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21
2017
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11
Heat Sink Material
Contact:
Business Consulting：+86-13526941255 Yanyan
Email：yanyan@achemetal.net
With the development of electronic technologies, the heating of components has increasingly become a bottleneck of their functions and service life. With constant improvement of functional efficiency of electronic elements and constant decrease of their volumes, thermal management of electronic systems has encountered severe challenges. Insufficient heat dissipation will cause bad influences on the efficiency and reliability of semiconductors. More than a half of electronic elements going wrong are caused by excessive heat. Electronic elements mounted on substrates can dissipate heat effectively only by a heat sink effect, thus stabilizing the operating temperature.
Tungsten-molybdenum and alloy materials have the following features:
a.Reliable heat dissipation;
b.Excellent high-temperature stability and uniformity;
c.Thermal expansion coefficients matched with those of sapphire substrates, silicon slices, gallium arsenide, ceramics and other materials;
Therefore, tungsten-molybdenum materials including pure molybdenum, molybdenum-copper, tungsten-copper and copper-molybdenum-copper (CMC) used for heat sink are used in LED packaging and electronic packaging in large quantity.
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